RESIN BOND DIAMOND  & CBN 

WAFERING & CUT OFF BLADES

Resin bond diamond wafring blades offer superior cut quality than any type diamond wafering blade available. Recommended for applications where cut quality and surface finish is very important. Compared to their sintered (metal bond) wafering blade counterparts. Resin Bond Diamond & CBN Waferings offer far superior cut quality than the finest size metal bond (sintered) bade. Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finish is desired. Most commonly used at higher speeds. CBN, Resin bond Wafering Blades are recommended for sectioning hard steels above Rc 60 at high speeds.

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  Produced using phenolic resin as the binder, diamond abrasive as cutting media, ceramic & other advanced components as filler. UKAM Industrial Resin Bond Diamond & CBN Wafering Blades are manufactured with advanced molding process. Available in a large variety of geometries, diamond sizes, diamond concentrations, and bond harnesses.

Resin Bond is the softest of all the bonds, frequently used in applications that require a smooth surface. This type of wafering blades is used on majority of ultra hard & brittle materials. Resin bond wafering blades allow the bond matrix to wear faster, and allow for diamond particles/crystals to break out of their matrix faster, so that new sharp diamond particles become exposed. This self sharpening characteristic of resin bond wafering blades, based on faster bond wear out is what make this blade an excellent choice for large variety of ultra hard and brittle materials.

Quantity Discounts available. Other Standard Arbor Sizes 3/4", 1", 1 1/4", 20mm, and 30mm available. We can make just about any ID (inside diameter) arbor size by request.

Guarantee: 100% Quality Guaranteed.

Precision Diamond Blade by itself is perhaps the most important factor in your precision diamond sawing operation. The diamonds impregnated inside the bond matrix of the diamond blade, are what actually participate in cutting action. No matter how precision or well made your saw. You will not be able to obtain the material surface finish, and precision tolerances you need, if the blade you are using is not right for your application. UKAM Industrial Superhard Tools proprietary blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after cutting. All blades are manufactured and available from inventory to fit your specific material, application, and surface finish requirements. We will work with you to determine your needs, and develop the right bond formulation, concentration, and grit sizes. SMART CUT ™ Precision Diamond Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed.

UKAM Industrial Superhard Tools is one of the Leading Precision Blade Manufacturers, with one of the Largest Inventory of Precision Diamond Blades in the U.S. Over 4,000 Precision & Ultra Thin diamond blades in stock, available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.

Most diamond & CBN Wafering Blade Users already know which blade to use for their application. This information is typically based on the blade item number already used or recommendation provided by saw manufacturer or consumables supplier. Blade specification is identified by item number for fast and easy reordering. Some obtain this information through literature or recommendation given by their customer support representative. Although the blade you are using now may be working satisfactory. Do you really know if it is the best solution to your needs? Many clients waste valuable time & money by using incorrect blade for their application. Some use blade with too fine size diamond particles, causing excessively long cutting times and material burning. Some use to thin of a blade for their material diameter/shape and prematurely bend, damage, or chip the diamond section. Most consumable vendors do not spend the time to educate the user on the wide variety of blade specifications and options available today. Nor provide the full blade specification per ANSI (American National Standards Institute) diamond & CBN blade labeling standards.  UKAM Industrial Superhard Tools specializes in manufacturing Diamond & CBN wafering & cut off blades for large variety of industries & applications (not just for laboratory / sample preparation) use. We have in stock over 20,000 diamond & CBN blades in wide variety of different specifications (not just specifications indicated above). We understand that your success depends on select the right tools & consumables, and optimizing them to best fit your needs. We believe that the best client is a well-informed client. The more you understand about what we can do for you, the better our partnership will be. On our web site you will find the Most Comprehensive Source of Information on Everything you wanted to know diamond & cbn wafering blades, cutting, grinding, & polishing. We are focused on your long term success and take great pride in helping you grow and prosper. Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade.  Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.   Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut. High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut. Diamond & CBN Particle size -  Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain.  Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.  Blade Thickness – Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request.  Kef thickness  typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning. For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. Blade Diameter – typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut.  Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades Bond Hardness – Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well.  However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness. Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond. Bond Type - Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials. Loads/Feed Rates – load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application. Wafering Blade Speeds/RPM’s - Most wafering blades are used between 50 to 6,000 RPM’s  Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

In 1998 UKAM Industrial Superhard Tools,  Division of LEL Diamond Tools International, Inc.  introduced  a  new  breakthrough: SMART CUT™  technology  in  manufacturing  precision diamond blades. This  technology  allows  us  to  properly  position  and  orient  the  diamond  inside  the  metal  matrix. Making  sure  every  diamond  is  in  the  right  place  and  at  the  right  time,  working  where  you  need  it  most. (Please,  see  diagram ….)

 maximum cutting performance – each  diamond  works  like  a  small  work  horse. Diamonds  come  in  contact  with  the  material  in  the  right  place  and  at  the  right  time,  working  where  you  need  them  most. You  get  the  maximum  use  out  of  diamond  and  bond. Some unique benefits & advantages of SMART CUT™ technology:

 no glazing – requires minimal dressing, the bond renews itself

 faster cutting action - Diamond blades manufactured utilizing this technology are much more aggressive than your conventional blades. They cut faster, still leaving behind a smooth finish.

 more universal & longer lasting - These diamond blades are designed to work on virtually any material you can find. You can cut very hard materials, than switch to cutting very soft materials and the blade will maintain the same consistent performance. 7mm diamond depth allows the blade to last 80% to 40% longer on the hardest materials

 superior coolant system - these blades are designed to cut with or without oil. We feel it is more preferable to the user to use water as a coolant. Oil does not a proper coolant for this procedure, as most other manufacturers would suggest. Water is a true organic coolant, witch does not leave the material being cut oily or greasy.