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Getting the Most from your Diamond Tools (171kb)
Getting the Most from your Diamond Sawing Operation (125kb)
Select the Right Diamond Blade for your Application (151kb)
SMART CUT™ technology (761kb)
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  • Freer and faster cutting action

  • Thinnest possible kerfs available

  • More forgiving to operator errors

  • Lower Cost 

  • May be used without coolant*

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  • PCB boards

  • Microelectronic packages

  • Fiber reinforced composites

  • Plastics

  • Fiberglass

  • Epoxy

  • Silicon

  • Bones

  • Softer alloy metals

Nickel Bond Diamond & CBN Wafering Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Unlike sintered (meal bond) wafering blades where diamond is impregnated inside metal binder matrix based on bronze, copper, nickel and other alloys. Nickle bond diamond wafering blades have diamond exposed right on surface of the blade. Hence they are able to provide more faster and freer cutting action than their sintered (metal bond) counterparts. Nickel bond diamond wafering blades are particularly well suited for cutting thermosetting plastics, GRP, pre-sintered and pre-fired (green) materials, electro carbons, graphite, soft ferrites, farinaceous products, deep frozen fish, pones, pc boards, and etc.

 CBN (cubic boron nitride) Wafering Blades are mainly used on tool and die steels, high alloy steels, and nickel rich alloys. This bond type also allows the diamond kerf retain is origional shape and dimension throught its working life. Nickel Bond Wafering Blades may be used dry (without coolant) on number of applications, where coolant cannot be used. However, the life & performance of the tool will be significantly superior when used with coolant.

Nickel bond wafering blades are better able to wistand operator error and abuse and are much lower cost then their sintered (metal bond) counterparts. Making them an attractive option for inexperienced and novice sectioning saw operators/users. Nickel Bond Wafering Blades are not designed for use on very low speeds. Typically minimum RPM’s should be 200. They are recommended where surface finish, dimensional accuracy or long life of bonded blades is not critical.

Nickel Bond Wafering Blades are available from stock in several mesh sizes of synthetic diamond & cubic boron nitride (CBN). Available with interrupted and continuous diamond coating kerfs. As well as stainless steel core for more rigidity and core steel with memory (which is almost undestructable). Steel core made from steel with memory. Always snaps back to its original shape no matter how much bent.


Will provider finer cut quality than interurupted rim nickel bond blades. Made with Stainless Steel Core

Diameter Thickness STRUERS Item No. UKAM Item No.

Diamond Size / Concentration


3" (76mm) .010" (0.25mm) 101CA 29-4669W  Fine / High REQUEST QUOTE
4" (101.1mm) .006" (0.15mm) ------ 29-4670W Fine / High REQUEST QUOTE
4" (101.1mm) .010" (0.25mm) ------ 29-4671W Fine / High REQUEST QUOTE
4" (101.1mm) .012" (0.3mm) 231CA

(produced upon request)

4" (101.1mm) .024" (0.6mm) ------ 29-4672W Medium / High REQUEST QUOTE
5" (127mm) .015" (0.4mm) 331CA 29-4673W Fine / High REQUEST QUOTE
5" (127mm) .024" (0.6mm) ------ 29-4674W Medium / High REQUEST QUOTE
6" (152mm) .014" (0.35mm) ------ 29-4675W Fine / High REQUEST QUOTE
6" (152mm) .020" (0.5mm) 433CA 29-4676W Fine / High REQUEST QUOTE
6" (152mm) .024" (0.6mm) ------ 29-4677W Medium / High REQUEST QUOTE
6" (152mm) .045" (1.14mm) ------ 29-4678W Coarse / High REQUEST QUOTE
7" (178mm) .025" (0.6mm) ------ 29-4679W Fine / High REQUEST QUOTE
8" (203mm) .024" (0.6mm) ------ 29-4680W Medium / High REQUEST QUOTE
8" (203mm) .045" (0.88mm) ------ 29-4681W Coarse / High REQUEST QUOTE


More freer cutting & aggressive  than continuous rim nickel bond blades. Made with Stainless Steel Core

Diameter Thickness UKAM Item No.

Diamond Size / Concentration

4" (101.1mm) .007" (.17mm) 29-4671W Fine / High REQUEST QUOTE
4" (101.1mm) .015" (0.38mm) 29-4675W Fine / Medium REQUEST QUOTE
6" (152mm) .009" (0.28mm) 29-4685W Fine / High REQUEST QUOTE
6" (152mm) .015" (0.38mm) 29-4687W Fine / Medium REQUEST QUOTE
6" (152mm) .027" (0.5mm) 29-4689W Medium / High REQUEST QUOTE
8" (203mm) .015" (0.38mm) 29-4690W Fine / High REQUEST QUOTE
8" (203mm) .027" (0.5mm) 29-4691W Medium / High REQUEST QUOTE
10" (252mm) .018" 29-4702W Fine / High REQUEST QUOTE
10" (252mm) .040" (1.0mm) 29-4703W Medium / High REQUEST QUOTE

Have Coarser and More Blocky diamond. Will Cut Faster.

Diameter Thickness UKAM Item No.

Diamond Size / Concentration


6" (152mm) .015" (0.38mm) 29-4704WC Very Coarse REQUEST QUOTE
8" (203mm) .015" (0.38mm) 29-4706WC Very Coarse REQUEST QUOTE
10" (252mm) .018" (0.45mm) 29-4706WC Very Coarse REQUEST QUOTE



Will provide faster sectioning speeds on soft and gummy metals and composite materials. Made from core steel with memory

Diameter Thickness

Diamond Size / Concentration


6" (152mm) .015" (0.38mm) Very Coarse REQUEST QUOTE
8" (203mm) .015" (0.38mm) Very Coarse REQUEST QUOTE
10" (252mm) .018" (0.45mm) Very Coarse REQUEST QUOTE

Quantity Discounts availableOther Standard Arbor Sizes 3/4", 1", 1 1/4", 20mm, and 30mm available. We can make just about any ID (inside diameter) arbor size by request.

Guarantee: 100% Quality Guaranteed.

Precision Diamond Blade by itself is perhaps the most important factor in your precision diamond sawing operation. The diamonds impregnated inside the bond matrix of the diamond blade, are what actually participate in cutting action. No matter how precision or well made your saw. You will not be able to obtain the material surface finish, and precision tolerances you need, if the blade you are using is not right for your application. UKAM Industrial Superhard Tools proprietary blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. 

Reducing and often eliminating additional steps often required after cutting. All blades are manufactured and available from inventory to fit your specific material, application, and surface finish requirements. We will work with you to determine your needs, and develop the right bond formulation, concentration, and grit sizes. 

SMART CUT ™ Precision Diamond Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed.

UKAM Industrial Superhard Tools is one of the Leading Precision Blade Manufacturers, with one of the Largest Inventory of Precision Diamond Blades in the U.S. Over 4,000 Precision & Ultra Thin diamond blades in stock, available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.


You are sure to find the Right Precision Diamond Blade for your application in stock and ready for same day delivery. If you are not using these blades, you are paying too much.


Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. 

Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.  

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond & CBN Particle size -  Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain.  Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended. 

Blade Thickness – Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. 

Kef thickness  typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning. For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.

Blade Diameter – typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. 

Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Bond Hardness – Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. 

However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness. Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Bond Type - Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Loads/Feed Rates – load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Wafering Blade Speeds/RPM’s - Most wafering blades are used between 50 to 6,000 RPM’s 

Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.


In 1998 UKAM Industrial Superhard Tools,  Division of LEL Diamond Tools International, Inc.  introduced  a  new  breakthrough: SMART CUT  technology  in  manufacturing  precision diamond blades. This  technology  allows  us  to  properly  position  and  orient  the  diamond  inside  the  metal  matrix. Making  sure  every  diamond  is  in  the  right  place  and  at  the  right  time,  working  where  you  need  it  most. (Please,  see  diagram ….)

 maximum cutting performance – each  diamond  works  like  a  small  work  horse. Diamonds  come  in  contact  with  the  material  in  the  right  place  and  at  the  right  time,  working  where  you  need  them  most. You  get  the  maximum  use  out  of  diamond  and  bond. Some unique benefits & advantages of SMART CUT™ technology:

 no glazing – requires minimal dressing, the bond renews itself

 faster cutting action - Diamond blades manufactured utilizing this technology are much more aggressive than your conventional blades. They cut faster, still leaving behind a smooth finish.

 more universal & longer lasting - These diamond blades are designed to work on virtually any material you can find. You can cut very hard materials, than switch to cutting very soft materials and the blade will maintain the same consistent performance. 7mm diamond depth allows the blade to last 80% to 40% longer on the hardest materials

 superior coolant system - these blades are designed to cut with or without oil. We feel it is more preferable to the user to use water as a coolant. Oil does not a proper coolant for this procedure, as most other manufacturers would suggest. Water is a true organic coolant, witch does not leave the material being cut oily or greasy.






Selecting Right Wafering Blade

Wafering Blade Usage Recommendations

Wafering Blade Case Studies

Customer Testimonials

Optimizing your Cutting Operation

Trouble Shooting Wafering Blade Problem

Getting the Most from your Diamond Tools

What you should know before you buy your next blade?




UKAM Industrial Superhard Tools  Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80  Valencia, CA 91355  Phone: (661) 257-2288  Fax: (661) 257-3833

e-mail: lel@ukam.com

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