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Metallographic Diamond Blade Case Studies
Diamond Wafering Blade Performance & Cutting Speeds Case
Study No. 1 New Generation Sintered (metal bond) diamond wheel with SMART CUT technology was tested against a conventional metal bond diamond wheel under similar conditions. Using three different materials, namely Aluminum, Brass, and Quartz, cuts were made to determine cutting times for all five diamond wheel types. Using a Model 650 Low Speed Diamond Wheel Saw, each diamond wheel blade was used for cutting the specified materials. Each specimen cut was a 12-millimeter diameter rod of material, helping maintain consistency during the cutting process. Specimens were first mounted onto a graphite plate, which was then mounted onto an aluminum mounting block. The entire system was then placed into the Model 65001 Single Axis Goniometer specimen mount of the Model 650. Specimens were mounted using MWH 135 low melting point wax (melting point at 100 degrees Celsius). The following diamond wheels were used in this experiment: Wafering
Blades Tested Conventional
Diamond Wafering Blade, Sintered (metal bonded) 4 diameter; 0.012
thickness; Mesh Size: coarse; Diamond Concentration: High New Generation, Sintered (metal bonded) Diamond Wafering Blade. 4 diameter; 0.012 thickness; Mesh Size: coarse Diamond Concentration: High. With SMART CUT technology. Each
diamond wheel was used to make three cuts on each sample, with a total of nine
cuts total per wheel. The diamond wheels were dressed with a silicon carbide
dressing stick immediately prior to cutting. The following cutting parameters
were used for each of the cuts made.
Case
Study No. 2 A small rod of 100 steel: 6
chromium 15mm in diameter by 35mm in length was obtained for cutting
tests. Three cuts were made to evaluate cutting time, surface finish, and
accuracy of the cut (parallelism) using different diamond wheels. The surface of
the part following cutting was inspected using an inverted optical microscope at
low magnification to qualitatively compare surface roughness. The width of the
sample following cutting (the thickness) was measured to determine if any
significant variation was observed in the specimens. Finally, a comparison of
cutting times was made to compare the wheel cutting efficiency as well. The
sample rod material was cut using similar conditions for each diamond wheel. The sample was mounted onto the Model 650 Low Speed Diamond Wheel Saw using a Model 65006 Vise sample holder. A water-soluble coolant was used to prevent excess heating during the cutting process, and was replenished after each cut. Cutting load was applied to the specimen directly onto the arm mechanism, and the counter-balancing weight was used to prevent wheel binding during the cutting process. A total cutting load of approximately 600 grams was used with the diamond wheel saw during each cut, and dressing of the blade was done periodically every hour during the cutting process. Cutting times and thickness variations of diamond wheels cutting 100 Steel: 6 Chromium sample
Wafering
Blades Tested: New
Generation Metal Bond Diamond Wafering Blade with SMART CUT technology Mesh
Size: 120 |
Cutting / Sectioning Materials with a High Metallic Content
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Case Study No. 3 Product:
10 x .040 x ½ New Generation metal bond Diamond Wafering Blade
with SMART CUT technology Application: Zr, Nb, Ti, Hf, and their alloys.
These are very tough, ductile metals. Saw Used: Struers Discotom 5 abrasive
cut-off saw Blade Life: 4 months Customer Comments: "We found that it worked well for cutting all of alloys and pure metals. It worked extremely well for sectioning carbide inclusions in Zircaloy. Before using your blade, we have had little success sectioning these types of samples." |
Case Study No. 7 Material: cobalt chromium Specimen Size: 4.0" Saw: South Bay 650
Cutting Speed SMART CUT New Generation Metal Bond Diamond Wafering Blade: 8 hours conventional metal bond diamond wafering blade: 13 hours Conclusion: SMART CUT
Diamond Wafering Blade cut Cobalt Chromium 1.62 times faster
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Case Study No. 4
Application: sectioning a client part
consisting of a thick stainless steel disk bonded by a proprietary process to an
alumina ceramic insulator.
Customer Comments: I had previously mounted this combo in epoxy and attempted to cut it on another manufacturer's low speed wafering saw using both their diamond blade and a wafering blade they had recommended for cutting metal. Both blades did well on the ceramic but even with constant dressing the cutting rate in the metal portion of the sample was infinitesimal and I gave up the effort after a whole day of effort. Your blade cut the same sample in approximately 15 minutes on the surface grinder and rates in the stainless steel portion were only slightly slower than in the ceramic. "
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Case Study No. 5
Cutting Speeds in Minutes Smart Cut Wafering Blades: 1.51 Conventional Blade: 5.15 Conclusion: SMART
CUT New Generation Metal Bond Diamond Wafering Blades
cut Copper 2.32 times faster |
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Case Study No. 6
Cutting Speeds in Minutes Cutting Speeds in Minutes Smart Cut Wafering Blades: 5.59 min Conventional Blade: 13 min Conclusion:
SMART CUT
New Generation Metal Bond Diamond Wafering Blades cut Copper 2.32 times
faster |
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Examples of cutting times for Sectioning of Specific Materials 0.25" (6.4mm) diameter rod. Using various cutting speeds.
| Material | Blade Type | Diamond Concentration | Speed (RPM's) | Load (grams) | Estimated Cutting Time |
| Hot Pressed Silicon Nitride Si3N4 | Series 20LCU | Low | 4,000 | 800 | 0:30 |
| Boron Carbide B4C | Series 20LCU | Low | 3,500 | 700 | 0:15 |
| Sapphire Al203 | Series 15LCU | Low | 1,500 | 300 | 0:40 |
| Chromium Doped Sapphire Al203 | Series 15LCU | Low | 500 | 500 | 0:20 |
| Partially stabilized Zirconia ZrO2 | Series 15LCu | Low | 2,500 | 500 | 0:38 |
| Silicon Carbide, SiC | Series 15LCU | Low | 2,500 | 500 | 0:16 |
| Case Hardened Steel | Series 15HCU | High | 2,500 | 500 | 0:16 |
| Grey Cast Iron | Series 15HCU | High | 2,500 | 500 | 0:25 |
| Titanium Alloy | Series 15HCU | High | 2,500 | 500 | 0:32 |
| Zinc Alloy | Series 15HCU | High | 2,500 | 800 | 0:15 |
| Tungsten Carbide 6% cobalt binder, wC | Series 15HCU | High | 4,500 | 900 | 0:15 |
| Tungsten Carbide 25% cobalt binder, WC | Series 15HCU | High | 1,500 | 300 | 1:55 |
| High Purity fused silica SiO2 | Series 15HCU | High | 2,500 | 500 | 0:40 |
| Extruded Alumina, Al203 | Series 15HCU | High | 3,000 | 600 | 0:40 |
| Aluminum Nitride AIN | Series 15HCU | High | 1,500 | 300 | 0:30 |
| Nickel Zinc Ferrite | Series 15HCU | High | 1,500 | 300 | 0:30 |
| Manganese Zinc Ferrite | Series 15HCU | High | 2,500 | 5,000 | 0:30 |
| Yttrium aluminum garnet, YAG | Series 15HCU | High | 3,000 | 600 | 1:15 |
| 8 micron graphite fiber reinforced zirconium diboride/molybenum disilicide composite | Series 15HCU | Low | 2,500 | 300 | 0:20 |
| White Cast Iron | Series Metacut CBN | High | 2,500 | 700 | |
| Thermal Spray Coatings | Series 15HCU | High | 3,000 | 700 |
What you should know before you buy your next diamond blade?
Selecting the right Diamond Wafering Blade for your application
Diamond Blade Guide & Getting the most from your Diamond Blades
UKAM Industrial Superhard Tools Division of LEL Diamond Tools International, Inc.
228231 Avenue Crocker, Unit 80 Valencia, CA 91355 Phone: (661) 257-2288 Fax: (661) 257-3833
e-mail: lel@ukam.com
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