Selecting right diamond dicing blade for your application

Feed rate: Half Etched substrates 30-75 mm/sec, Full Copper substrates 15-30 mm/sec
Spindle speed: 22-35 krpm depending on blade O.D.
Multi panel mounting on UV tape
Override process over one substrate to reach final feed rate

LED (Light-Emitting Diode)

Common Materials - Copper, HTCC (High Temperature Co-fired Ceramics), LTCC (Low Temperature Co-fired Ceramics).

Typical Concerns:

Copper burrs
End of blade life due to limited exposure
Throughput (maximize UPH)

Dicing Blade Recommendation:

SMART CUT HYBRID BOND or Nickel Bond series
Diamond size: 10,13 & 17 microns
Thickness: .003” - .008”

Dicing Process Recommendations:

Feed rate: 80-150 mm/sec
Spindle speed: 25-30 krpm
Multi panel mounting on UV tape

CMOS (Complementary Metal-Oxide Semiconductor)

Common Materials - Borosilicate Glass, HTCC (High Temperature Co-fired Ceramics).

DWDM (Dense Wavelength Division Mulitplexing) Filters

Common materials: Glass, Quartz.

Typical Concerns:

Top-side and back-side chipping
Cut perpendicularity
Kerf side surface finish

Dicing Blade Recommendation:

SMART CUT series Resin, HYBRID, & Sintered (metal bond) blades
Diamond size: 30 - 45 microns (resin) and 7 - 15 microns (sintered)
Thickness: .006" - .012”

Dicing Process Recommendations:

Feed rate: 4 - 20 mm/sec
Spindle speed: 20 - 30 krpm (2") 10 - 15 krpm (4")
Dicing synthetic water soluble coolants may reduce chipping and improve surface finish

HDD (Hard Disk Drive)

Common Material: AlTic (Aluminum Titanium Carbon), Ferrite Ceramic.

Typical Concerns:

High Mechanical (internal) stress
burrs
large kerf width
lack of accuracy

Dicing Blade Recommendation:

The MR head substrate is made of ferromagnetic ceramic material, which has an extremely hard wear resistance and excellent magnetic properties. a typical MR substrate is AlTiC. Substrate thickness typically ranges from 200 to 300 microns. Substrates for HDD read heads require machining after being sintered into bars or sheets. Than they have to be diced into very small unit with very high precision tolerances.

Semiconductor Wafer

Common Material: Silicon, LiNbO3 (Lithium Niobate).

Typical Concerns:

Top-side and back-side chipping
Cracking
Wafer contamination due to ESD issues and poor cleaning

Dicing Blade Recommendation:

SMART CUT Nickel Bond or HYBRID series
Diamond size: 4 - 6 microns
Thickness: .0008” - .0016”

Dicing Blade Recommendation:

Feed rate: 25 - 75 mm/sec
Spindle speed: 30 - 50 krpm
Mounting: Blue or UV tape
Cooling type: DI water with and without additives
Carbon dioxide bubbler is optional

Silicon & GaAs are the two most common materials used for semiconductor wafers. Wafers are typically available in sizes up to 12" in diameter, with 6" and 8" most popular. Typical thicknesses are between 100 - 650 microns.

DICING BLADE GUIDE

Selecting Right Dicing Blade

Dicing Operation Recommendations

Optimizing Dicing Blade Performance

Trouble Shooting Dicing Problems

Getting the most from your Diamond Tools

Application Recommendations & Case Studies

DICING BLADES

DICING SOLUTIONS

What you should know before your buy your next dicing blade?

UKAM Industrial Superhard Tools Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80 Valencia, CA 91355 Phone: (661) 257-2288 Fax: (661) 257-3833

e-mail: lel@ukam.com


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