Diamond Tools, Dicing Blades, & Consumables for Semiconductor & Microelectronics Industry

Diamond & CBN

Dicing Blades SMART CUT ® technology

Dicing Blades from 0.5" (12.7mm) to 6" (154mm) in Diameter, starting from .001" (25 microns) Thick For all applications and all types of Dicing & Slicing machines

When it comes to dicing, there is only one company that stands out. UKAM Industrial Superhard Tools is a one of the leading precision U.S. diamond dicing blade & tool manufacturers. As the first company to develop SMART CUT™ technology, UKAM Industrial is a Partner in Your Success. We have the Experience, Tradition, and the People to improve & optimize your dicing operation. Contact us for Free Quote & application recommendation today!

For Semiconductor

Other Diamond Tools & Products

Dicing

Accessories & Consumables

Nickel Bond Hubless

Dicing Blade Applications

Green Ceramic
Optical Glass
PCB

Silicon
Optical Fiber Ferrule

AlTic
Metal Oxide

Dicing Blade Characteristics

Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.

Dicing Blade Bonds

EZC I

EZC II

EZC III

Abrasive (Diamond/CBN) Sizes

3 to 70 micron

Abrasive (Diamond/CBN) Types

Natural & Synthetic Diamond

Abrasive Concentration

100 to 250 con

Minimum Dicing Blade Thickness

.0003" (0.0076mm)

How To Select The Right Diamond Dicing Blade

For Your Application

Dicing Blade Bond Types

Resin

Sintered
(Metal Bond)

Hybrid
Bond^TM

Nickel Bond (Hubless)

Nickel Bond (Hubbed)

Bond Illustration

Sem Image

Description:

Organic bond matrix that is formed by high pressure and high temperature

Metallurgical Bond with multiple ayers of diamonds impregnated inside the metal matrix.

Organic bond matrix that is formed by high pressure and high temperature

Halvanic process, where diamond is deposited on steel body in chemical solution by time.

Galvanic process, where diamond is deposited on steel body in chemical solution by time.

Dicing Blade Applications

Alumina
Barium Titanate
Garenet
Glass & Quartz
Ferrite
LiNb03
Silicon
Fused Silica
Electronic Ceramics
Sapphire

FR4/BT Resin
Alumina
Glass
Copper & PCB
AITIC
Green Ceramic
Plastic Laminates
Zirconia
Rare Earth Magnets
Fired Multi Layered Ceramics

BGA Packages
QFN
Aluminum oxide (A1203)
Silicon nitride (Si3N4)
Silicon carbide (SiC)
Sapphire Boron Carbide (B4C)
Alsmag
LiTaO3 & LiNbo
FR4 and Resin

Green Ceramic
Silicon
AlTic
Optical Glass
Optical Fiber Ferrule
Metal Oxide
PCB

Silicon
GaAs
Sapphire
SIC

Dicing Blade Characteristics

Resin Bond dicing blade are typically more forgiving. self dressing, and freer cutting. Excellent choice for Ultra Hard & Brittle Materials. Recommended for applications where cut quality and surface finish is very important.

Sintered (metal bond) Dicing blades have excellent form holding & corner characteristics, provide very long life, high level of consistency. Recommended for users requiring very straight cuts and larger blade
exposures.

You will find all the advantages of cutting speed and fine finish that you have come to expect in a resin bond, and long life, consistency, aggressiveness, durability, and excellent performance on you look for in a metal bond.

Nickel Bond Hubbed dicing blades are typically used for dicing silicon and III-V materials. Creates very thin kerfs, <50 microns. Providing excellent cut quality with low wear rate

Adventages

Self Dressing
Freer Cutting
Cuts almost any material
Clan cuts on hard and brittle material
Any blade thickness is available .003" and up
Minimum dressing required
Wide variety of bond matrixes and specifications available
Lower Cost

Longer Life
Minimized blade wear
high cutting ability
Improved blade rigidity
Highly accurate blade dimensions
Minimal Chipping of Critical Edges
Large Variety of Bond Matrixes for all Applications

Maximum Cutting Performance
No Glazing
Faster Cutting Action
Improved Surface Finish Better Coolant Retention
No Material Deromration
No Contamination

Very low blade wear
Maintains good edge geometry
Excellent on applications requiring high accuracy
Ultra thin blade thickness are available such .0006" (0.018mm)

Very low blade wear
Maintains good edge geometry
Excellent on applications requiring high accuracy
Ultra thin blade thickness are available such .0006" (0.018mm)

Dicing Blade Bonds

SC1R
SC2R
SC3R
SC4R
SC5R
SC6R
SC7R

SC1M
SC2M
SC3M
SC4M
SC5M
SC6M
SC7M

SC1H
SC2H
SC3H
SC4H
SC5H
SC6H
SC7H

EZC I
EZC II
EZC III

SNBI
SNBII
SNBIII

Abrasive (Diamond/CBN) Sizes

3 to 151 micron

3 to 126 micron

3 to 151 micron

3 to 70 micron

2 to 50 micron

Abrasive (Diamond/CBN) Types

Coated & Uncoated Synthetic Diamond or CBN

Natural Diamond, Coated &
Uncoated Synthetic Diamond or CBN

Coated & Uncoated Synthetic Diamond or CBN

Natural & Synthetic Diamond

Type of Diamond/CBN Used:

High friability, excellent microfracturing

Cubo-octahedral crystals, semi crystaline crystals

High friability, excellent microfracturing

Medium tough

Example of diamond Crystal Used:

Abrasive Concentration

25 to 200 con

100 to 250 con

Minimum Dicing Blade Thickness

.003" (.076mm)

.004" (0.101mm)

0003" (0.0076mm)

.0003" (0.0076mm)

SMART CUT® Precision Diamond Dicing Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed

Dicing blade OD : 0.5 in. to 8.0 in. (12 mm to 200 mm))
Dicing blade thickness : As thin as 0.003 in. (0.076 mm)
Diamond & CBN Abrasive Sizes : 3 to 151 micron
Diamond/CBN Abrasive Concentration : 25 to 200 con
Abrasive (Diamond/CBN) Types : Natural Diamond, Coated & Uncoated Synthetic Diamond or CBN

UKAM Industrial Superhard Tools has over 50 years of experience in Manufacturing, Research & Development of Ultra Thin & High Precision Diamond Dicing Blades for many Industries/Applications. We are a “Partner in Your Success”.

Equipment Used On:

K & S (Micro-Swiss)
Disco
ADT
Veeco
MECO
MTI
ITI
Meyer & Burger
Surface Grinders
Many Others

We Can Help You:

ITS WHAT YOU CANT SEE THAT MAKES ALL THE DIFFERENCE

SMART CUT® technology

How SMART CUT ® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ® Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.