Nickel Bond Dicing Blades - SMART CUT technology

SMART CUT™ Nickel Bond Hubless series New Generation & Technology Dicing Blades, have a high diamond concentration and give a freer, faster cutting action with minimum heat generation. Diamonds have higher protrusion ratio, staying on the surface of the cut allowing for fast material removal. Hubless Nickel Bond dicing blades are capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond hubless dicing blades provide lower wear rate, longer life, and minimum level of chipping on wide variety materials.

SMART CUT™ Nickel Bond Hubless are produces in highly controlled, clean room environment under the Highest Quality Standards. Only the highest quality raw materials are used in manufacturing process. Utilizing world class quality control, inspection, and measurement equipment.

Highly Experienced Engineers and chemists constantly monitor and control all material input & output at all stages of manufacturing process. Insuring product consistency for use in demanding & sensitive applications such Nano Technology, MEMS, etc. This process allows for blades to be produced with very tight tolerances, and optimize kerf shape, geometry, diamond size, and bond hardness to fit your particular application/requirements.

Manufactured utilizing SMART CUT™ technology, each diamond works like a small horse. Diamonds come in contact with the material in the right place and at the right time, working where you need them most. You get the maximum use out of diamond and bond.

Diamonds are oriented inside metal matrix, so that every diamond is better able to participate in cutting action.

Nickel Bond Dicing Blades last less than metal bond, resin bond, hybrid bond blades and are the least expensive dicing blades available. Silicon wafer dicing is usually done with the plated diamond blade (hubbed or hubbless) which has proven most effective for this application. The Kerfs are typically in the 1-3 mil. range using a nominal spindle speed of 30,000 RPM with feed rates as high as 8 inch per sec.

SMART CUT™ SERIES (SC) 1A8 NICKEL BOND (HUBLESS) DICING BLADE SPECIFICATIONS

Size designation: D x TE x H, where: D-Outside Blade Diameter, TE –Blade Thickness, H- Blade Inside Diameter.

Note: Our standard Tolerance on Outside Diameter for all blades is +/-.002”, tolerance. Higher tolerances are available upon request

HOW TO ORDER
*Diamond or CBN concentration Material / Application Abbreviations

N/N D
(Outer diameter)
TE¹
(Blade thickness)
H
(Inside diameter)
T
(Blade tolerance)

1
4.60” (116.84)

.002” - .080”
(.051 … 2.0)
3.50”
(88.9)

   1,2,3,4,5,6,7,8

2
4.50”

(114.3)

.002” - .080”
(.051 … 2.0)
    3.50”
   (88.9)

   1,2,3,4,5,6,7,8

3
3.00”

(76.2)

.002” - .080”
(.051 … 2.0)
1.575”
(40)    1,2,3,4,5,6,7,8

4
3.00”

(76.2)

.002” - .080”
(.051 … 2.0)
   1.250”
(31.75)    1,2,3,4,5,6,7,8

5 2.05”÷2.2835”
(52÷58)

.002” - .080”
(.051 … 2.0)
1.575”
(40)

   1,2,3,4,5,6,7,8

25, 35,50,

75,100,

125,150,

200

PLEASE SEE TABLE BELOW FOR MATERIAL ABBREVIATIONS

ABBREVIATIONS

TE¹	Thickness of the blades is available in .0001” increments
T1...T8	Tolerance of the blade thickness. Available tolerances
	T1-±.0001”( ±2.5µm); T2- ±.0002”( ±5µm); T3- ±.0003”( ±7.5µm); T4- ±.0004”( ±10µm)
	T5-±.0005”( ±12.5µm); T6- ±.0006”( ±15µm); T7- ±.0007”( ±17.5µm); T8- ±.0008”( ±20µm);

All sizes in parentheses are in millimeters (mm). An example (76.2) is indication of 76.2 mm.

* LOW CONCENTRATION AVAILABLE ON REQUEST.

BOND HARDNESS

A - Hard Bond

B - Soft Bond

Below is a guide to help you select the right Diamond Size for your Nickel Bond Hubless Dicing Blades for your application

APPLICATION	RECOMMENDED DIAMOND SIZE
PCB (LED Packages) FR4 and BT Resin	10 µm, 13 µm, 17 µm
PBGA FR4 and Epoxy Molding	30 µm, 50 µm
Multi-Layer Capacitors Green Ceramic	30 µm, 50 µm, 70 µm
Ultrasound Sensors Micro Positioners (PZT)	6-8 µm, 10 µm
Tape Heads (Ferrite)	3-6 µm, 10 µm, 13 µm
Magnetic Heads (TiC)	3-6 µm, 10 µm, 13 µm

HANDLING

Please note that nickel bond dicing blades are not 100% resilient, that is if a blade is deformed through mishandling it will allays retain a certain amount of that deformation. Though that some mishandling may not have noticeable impart on the cut quality (this would depend on parameters required and the amount of damage done). Nevertheless, proper handling procedure is important to the safe use, and overall robustness of any precision grinding process.

Always inventory the blades in the original package as packaged from us. This will not only protect the blades, but allow the necessary blade information to be available on hand.
Store the package away from obvious hazards such as water, hear and dust
Clean hands and clean bench is required for any inspection or inventory purposes
Handle the blades using the inside diameter hole whenever possible

CLEANING

A careful and through cleaning is an important step to a reliable diamond glade cutting process. Below are some guideless
All cleaning should be done in an area that is as particulate free as possible, a clean room is optimal, but not absolutely required.
Use a residue free cleaning solvent, isopropyl alcohol is recommend, but acetone is also acceptable
Use clean, laboratory grade lint free wipes
Always visually inspect for any debris or particulate that might be imbedded or otherwise requires special or added treatment to remove

MOUNTING (stacking)

There a re numerous mounting systems (Arbor, Hub, Flange) each requiring slightly different components and procedures. Below are some recommendation:

The mounting hardware (arbor, hub, flange) and the stacking components (Spacers, Blades) must be clean of any debris
A through visual inspection for burrs dings dents or other damage.
Mechanically inspect the mounting hardware for axial and radial run out to verify that all is within specification
Assemble and inspect per manufacturer instructions

TRUING

The truing of a diamond blade is an important step towards a repeatable and robust cutting process. Without this step the blade or the material can become damaged due to the “hammering” caused by excessive radial run out of the blades. This damage can lead to inconsistent blade performance and cut quality, and in extreme circumstances blade failure.

DRESSING

Blade dressing is an important part of precision cutting process. With an optimized dressing system and intervals the cutting forces will be stable and predictable

Use the blade recommend dressing system (stick, plate or board) and process. This will optimize the diamond protrusion for maximum blade life and cut quality. Deviations from those recommendations should be used with considerable causation.

There are many variables involved with the selection of a suitable blade dressing systems. Including bond type, bond hardness & bond structure. Abrasive size and type, abrasive concentration, the blade form and size.

Generally speaking the size of abrasive particles used in the dressing system (whether stick, plate or board) should be slightly larger than the abrasive size of nickel bonded dicing blade being dressed.

UNDER CONSTRUCTION

DICING BLADES

DICING SOLUTIONS

DICING BLADE GUIDE

Selecting Right Dicing Blade

Dicing Operation Recommendations

Optimizing Dicing Blade Performance

Trouble Shooting Dicing Problems

Getting the most from your Diamond Tools

Application Recommendations & Case Studies

What you should know before your buy your next dicing blade?

UKAM Industrial Superhard Tools Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80 Valencia, CA 91355 Phone: (661) 257-2288 Fax: (661) 257-3833

e-mail: lel@ukam.com


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