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New
CE certified Precision
Diamond Slicing / Dicing
Saw is
designed for Laboratory and R & D use. This machine can be used for
slicing, dicing or cutting all kinds of materials up 4"
diameter wafer
or rectangular material up to 8" length x 4"
width x 1"in depth
saw is fully controlled by a computer ( any PC or Desktop
computer) with position accuracy of 0.01 mm or better. The
sample stage with two-angle adjustment comes with the machine, which
allows customers to cut materials at desired angle with +/- 0.5 Deg
tolerance. Variable speed up to 3,000 RPM (with option of extending out
to 10,000 RPM). Accepts all types of blades. Including Precision Diamond Slicing, Dicing,
& Wafering Blades from 3" to 6" in diameter. Such as
Sintered (metal bond), Resin Bond, & Electroplated (nickel bond)
hubless blades 1A1R, 1A8, 1A1, and etc. Affordable precision and cost effective dicing and cutting saw
for R&D Labs in Materials and Micro-electronics Research. Typical
applications that have benefited from the use of this machine include:
wafers and sheets of optical, optoelectronic, semiconductor ceramic or
related materials that need to be sectioned into smaller squares or
rectangles. If
this slicing/dicing
saw can meet your needs in dicing and cutting, why do you have
to pay more for an expensive dicing saw? |
Precision Diamond Saw
Guide:
Features:
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Dicing /
Slicing Saw has 1/2 HP high
torque DC motor with variable speed up to 3,000 rpm (variable speed
up to 10,000 RPM optional) which can
be operated at the voltage from AC 110V to 240 V.
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The cutting
sample can be moved either by program or manual with X,Y, and Z
three-dimension linear motion up to X = 8", Y=4" and Z =
4"
The CNC controlled step motor operates with 0.0025 mm moving
resolution and 0.01 mm position accuracy.
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A user
friendly software allows customers to cut, slice or dice automatically
via using 486 IBM compatible computers, which are installed Windows
XP, Windows
98 or Windows Me system.
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Your
existing computer can be used to operate this saw. (computer
laptop pre loaded with all software needed to operate machine is now
included in the price of machine)
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One 4"
dia x 0.3 mm thick fully sintered diamond blade, and two sets
of flanges with 62 mm dia. ( for dicing ) and 42 mm dia ( for
deep cutting) Included.
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One any
blade specification from 75mm to 150mm OD any thickness from
.006" to .060. any bond type sintered (metal bond), nickel bond
or resin bond (your choice)
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Assemblies
of water jetting , draining, and splashing protection Included
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Technical
Information
Standard
Package Features:
1.
A cutting machine with a spindle motor and three step motors
2. One three-axis step motor driver with 3 cables to the
CNC machine , and one cable to the computer system. (No computer included)
3. computer laptop pre loaded with all software needed
to operate machine is now included. Software under Windows XP, Windows
98 or Windows Me system.
4. All Accessories necessary for you to begin
operating, right out of the box. See Standard Package Features for more
information.
Dimensions: 580 L x 560 W
x 660 H mm, & net weight of 28.5 Kg
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Standard Package Features:
(Please click on thumb
picture to enlarge image)
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Optional Accessories:
(Please click on thumb
picture to enlarge image)
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4"
Vacuum chuck
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4" Rotary
table for precision dicing or cutting
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4" Vacuum
chuck steel plate for holding samples
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110V Immersion
water pump with a voltage converter for coolant circulation
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110V or 220V Vacuum
pump for holding wafers
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Adhesive film
for wafer holding
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Blade clamps
(90 mm in dia.)
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Dicing blade
clamps (85 mm in dia)
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M25 (25x )stereo
microscope with frame mechanism
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Digital microscope
head for M45 microscope with software
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coolant circulating
tank /pump
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Water splash guard
for covering 6" blade
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86 mm dia x 0.1 mm
ultra-thin diamond blade with flange
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*
Optional parts are not included in standard package. And must be
ordered separately.
dicing
blades of almost any specification from thin as 100 microns to 1,000
microns can be used on this machine (almost any blade specification is
available from stock)
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Dicing
Software now Windows XP Compatible
Examples of
Diamond Slicing & Dicing Blades that can be used used with this Slicing /
Dicing Saw
SMART
CUT™ Precision Diamond Sectioning have been successfully implemented
and proven in hundreds of advanced materials and applications. SMART
CUT™ Precision Manual and Semi-Automatic Saws provide Advanced
Material Laboratories and Manufacturing Facilities consistent performance
as fully automatic saws, at small fraction of the cost. With ever
increasing budget cuts, many facilities find the use of Precision Sawing/Sectioning
Equipment and Consumables cost prohibitive.
Fully
automatic Precision Sawing machines usually cost several thousand and even tens
thousands of dollars. Yet, most Advanced Material Manufacturing and R & D facilities very rarely require
the functionality of high cost, automatic sectioning saws. SMART
CUT™ series of Precision Diamond Saws have been designed to provide
the material researcher or engineer the same capabilities they would expect from
high cost automatic sectioning saws, at literally small fraction of the price. Start
Saving Money Today!
We
recognize that the Diamond Wafering / Sectioning Blade by itself is
perhaps the most important factor in your sectioning / precision diamond sawing
operation. The diamonds impregnated inside the bond matrix of the
wafering blade, are what actually participate in cutting action. No matter how
precision or well made your wafering saw. You will not be able to obtain the
material surface finish, and precision tolerances you need, if the blade you are
using is not right for your application. UKAM
Industrial Superhard Tools proprietary blade chemistry, precision manufacturing
methods, modern quality control methods, allow us to control and regulate the
dozens of variables that affect blade life, quality of cut, surface finish.
Reducing and often eliminating additional steps often required after sectioning.
All blades are manufactured and available from inventory to fit your specific
material, application, and surface finish requirements. We will work with
you to determine your needs, and develop the right bond formulation,
concentration, and grit sizes. SMART
CUT™ Precision Diamond Wafering
Blades are designed and specially selected to provide maximum possible blade
life, for your desired cut quality and speed.
UKAM
Industrial Superhard Tools is one of the Leading Diamond Wafering Blade
Manufacturers, with one of the Largest
Inventory of Precision Diamond Wafering Blades
in the U.S. Over 4,000 diamond wafering
blades in stock, available in
different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh
sizes, and bond hardness's.
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You are sure to find the Right Diamond Wafering Blade for
your
application in stock and ready for same day delivery. If
you are
not using these blades, you are paying too much. |
What
you will save on the cost of consumables and Diamond Wafering Blades will more
than pay for the saw in short period of time.
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DICING
BLADES |
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DICING
SOLUTIONS
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| DICING
BLADE GUIDE |
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