Diamond Wafering Blades, cross sectioning, failure analysis.

Diamond Wafering / Sectioning Blade by itself is perhaps the most important factor in your sectioning / precision diamond sawing operation.

Examples of cutting times for Sectioning of Specific Materials 0.25" (6.4mm) diameter rod. Using various cutting speeds.

Material	Blade Type	Diamond Concentration	Speed (RPM's)	Load (grams)	Estimated Cutting Time
Hot Pressed Silicon Nitride Si3N4	Series 20LCU	Low	4,000	800	0:30
Boron Carbide B4C	Series 20LCU	Low	3,500	700	0:15
Sapphire Al203	Series 15LCU	Low	1,500	300	0:40
Chromium Doped Sapphire Al203	Series 15LCU	Low	500	500	0:20
Partially stabilized Zirconia ZrO2	Series 15LCu	Low	2,500	500	0:38
Silicon Carbide, SiC	Series 15LCU	Low	2,500	500	0:16
Case Hardened Steel	Series 15HCU	High	2,500	500	0:16
Grey Cast Iron	Series 15HCU	High	2,500	500	0:25
Titanium Alloy	Series 15HCU	High	2,500	500	0:32
Zinc Alloy	Series 15HCU	High	2,500	800	0:15
Tungsten Carbide 6% cobalt binder, wC	Series 15HCU	High	4,500	900	0:15
Tungsten Carbide 25% cobalt binder, WC	Series 15HCU	High	1,500	300	1:55
High Purity fused silica SiO2	Series 15HCU	High	2,500	500	0:40
Extruded Alumina, Al203	Series 15HCU	High	3,000	600	0:40
Aluminum Nitride AIN	Series 15HCU	High	1,500	300	0:30
Nickel Zinc Ferrite	Series 15HCU	High	1,500	300	0:30
Manganese Zinc Ferrite	Series 15HCU	High	2,500	5,000	0:30
Yttrium aluminum garnet, YAG	Series 15HCU	High	3,000	600	1:15
8 micron graphite fiber reinforced zirconium diboride/molybenum disilicide composite	Series 15HCU	Low	2,500	300	0:20
White Cast Iron	Series Metacut CBN	High	2,500	700
Thermal Spray Coatings	Series 15HCU	High	3,000	700

SMART CUT™ Precision Diamond Saws

SECTIONING SAWS, GRINDERS/POLISHERS & CONSUMABLES

For R & D and Manufacturing Organizations on a Budget

UKAM Industrial produces complete range of Sectioning Saws and Accessories for sample preparation (sectioning) of advanced materials, ultra hard & brittle materials, optics, composites, metals and etc. Typical applications include materials such as: ceramics, glass, plastics, quartz, metals, and graphite. Most samples / materials can be sectioned in seconds or few minutes with no material deformation. Preserving true sample / material micro structure. Providing equal Precision, Productivity and Versatility as High Cost Fully Automatic Diamond Wafering Saws, at a small fraction of the price. Find out more >>>

Used for: R & D, Quality Control, Failure Analysis, Production

Diamond Wafering Blades News Release

In 1998 UKAM Industrial Superhard Tools, Division of LEL Diamond Tools International, Inc. introduced SMART CUT technology, a new breakthrough in manufacturing precision diamond wafering blades. The company maintains this technology will redefine the standard in cutting.

This technology allows us to properly position and orient the diamond inside the metal matrix. Making sure every diamond is in the right place and at the right time, working where you need it most.

This technology has also allowed us to develop a NEW GENERATION HYBRID BOND diamond bond matrix. In a SMART CUT™ diamond bond you will find all the advantages of cutting speed and smoothness that you have come to expect in a resin bond, and unique characteristics of a metal bond in terms of life, aggressiveness, durability, and excellent performance on you look for in a metal bond.

maximum cutting performance – each diamond works like a small horse. Diamonds come in contact with the material in the right place and at the right time, working where you need them most. You get the maximum use out of diamond and bond.

no glazing – blade requires minimum dressing, the bond renews itself. Compare to conventional diamond wafering blades that frequently require repeated dressing.

faster cutting/sectioning action - Diamond wafering blades manufactured utilizing this technology are much more aggressive than your conventional blades. Section ultra hard materials, advanced materials, brittle materials, optical materials, metals, & semi conductor materials up to 3 times faster. While still preserving material true micro structure & leaving behind a smooth surface finish.

more universal - SMART CUT Diamond Wafering Blades are designed to work on practically any material you can find, You can cut very hard materials, than switch to cutting soft materials and the blade will still maintain the same consistent performance.

superior coolant system - these blades are designed to cut with or without oil. We feel it is more preferable to the user to use water as a coolant. Oil does not a proper coolant for this procedure, as most other manufacturers would suggest. Water is a true organic coolant, witch does not leave the specimen being cut oily or contaminated.

More sturdy alloy core – SMART CUT Diamond Wafering Blades are made with very durable proprietary alloy steel or non-magnetic core. Designed to withstand heavy use and exploitation in a wide variety of difficult environments and materials. You can expect less blade wreckage and blade walking, due to loss of wafering blade core tension.

UKAM Industrial Superhard Tools Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80 Valencia, CA 91355 Phone: (661) 257-2288 Fax: (661) 257-3833

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